CPMT Austin Chapter Meetings

2012 Meetings

Seminar Topic Presenter Affiliation   

November 17, 2011 3D Full-wave, Package-Board Simulation Aided by the Cloud Dr. Dipanjan Gope , Nimbic R&D, vice president   
January 19, 2012 Recess   
February 16, 2012 Causality, checking causality, and impact on time-domain simulations Brian Young TI
March 19, 2012 Stress issues on Cu-TSV performance and investigating grain structure changes by thermal cycle test Jay Im UT   
April 16, 2011 The Role of RT-HPC in the Evolution of the Advanced Manufacturing Industry, Mr. Igor Alvarado
May 17, 2012 3D TSV Challenges and Opportunities, Dr. Jan Vardaman, Tech Search Inc. 
June 21, 2012 Recess

The following is the regular meeting information for May.

When: May 17, 2012 (Thursday)
Time: 6:00PM - 7:30PM 
Location: Freescale, Building B 
       7700 Parmer Ln 
       Austin, TX 78729 
(Enter the driveway to Freescale from Parmer Ln. See the details in the attachment) 



Agenda for the Meeting 

6:00PM to 6:30PM - Social with Food & Drinks 
6:30PM - Seminar starts 
      Technical presentation by Mr. E. Jan Vardaman
      "3D TSV Challenges and Opportunities" 
7:30PM - Meeting ends 
       Concluding Remarks 

Invited Speaker: E. Jan Vardaman, president and founder of TechSearch International, Inc.,

Topic:  3D TSV Challenges and Opportunities 

Abstract:   
As 3D TSV production moves into the commercialization phase, technical and business issues remain. Resolving these issues is an important step in moving into high volume manufacturing with the technology. Key process steps still requirement improvement and higher yield. Once the technical issues are resolved, business issues such as supply chain handoff remain. As the boundary between the foundry process and the assembly process continue to blur, there is a struggle to determine which organizations can best meet customer needs in assembly and test. This presentation outlines the strengths of both and examines supply chain implications in the division of labor and industry readiness. Areas requiring technical developments are highlighted.

Biography of Mr. Igor Alvarado: 
E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided licensing and consulting services in semiconductor packaging since 1987. She is the co-author of How to Make IC Packages (published in Japanese by Nikkan Kogyo Shinbunsha), a columnist with Circuits Assembly/Printed Circuit Board Fabrication, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a member of IEEE CPMT, SMTA, MEPTEC, IPC, IMAPS and SEMI. She was elected to two terms on the IEEE CPMT Board of Governors. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium. She has made numerous presentations and organized panel discussions on 3D TSV.

Upcoming future events: 
Recess in June, 2012 
Regular technical meetings will resume in August